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  Analysis of Thermomechanical Stresses in Silicon During Heating of Aluminum Interconnects on its Surface by a Pulse Current
 
 
Title: Analysis of Thermomechanical Stresses in Silicon During Heating of Aluminum Interconnects on its Surface by a Pulse Current
Author: Skvortsov, Arkady A.
Nikolaev, Vladimir K.
Koryachko, Marina V.
Skvortsov, Pavel A.
Volkov, Evgeniy I.
Appeared in: SILICON
Paging: Volume 15 () nr. 10 pages 4417-4424
Year: 2023-02-27
Contents:
Publisher: Springer Netherlands, Dordrecht
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

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