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  Advancements in Biodegradable Printed Circuit Boards: Review of Material Properties, Fabrication Methods, Applications and Challenges
 
 
Title: Advancements in Biodegradable Printed Circuit Boards: Review of Material Properties, Fabrication Methods, Applications and Challenges
Author: Soon, Chin Fhong
Yee, See Khee
Nordin, Anis Nurashikin
Rahim, Rosminazuin Ab
Ma, Nyuk Ling
Hamed, Intan Sue Liana Abd
Tee, Kian Sek
Azmi, Nur Hanisah
Sunar, Norshuhaila Mohamed
Heng, Chris
Appeared in: International journal of precision engineering and manufacturing
Paging: Volume 25 () nr. 9 pages 1925-1954
Year: 2024-05-14
Contents:
Publisher: Korean Society for Precision Engineering, Seoul
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

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