Advancements in Biodegradable Printed Circuit Boards: Review of Material Properties, Fabrication Methods, Applications and Challenges
Title:
Advancements in Biodegradable Printed Circuit Boards: Review of Material Properties, Fabrication Methods, Applications and Challenges
Author:
Soon, Chin Fhong Yee, See Khee Nordin, Anis Nurashikin Rahim, Rosminazuin Ab Ma, Nyuk Ling Hamed, Intan Sue Liana Abd Tee, Kian Sek Azmi, Nur Hanisah Sunar, Norshuhaila Mohamed Heng, Chris
Appeared in:
International journal of precision engineering and manufacturing