Advancements in Biodegradable Printed Circuit Boards: Review of Material Properties, Fabrication Methods, Applications and Challenges
Titel:
Advancements in Biodegradable Printed Circuit Boards: Review of Material Properties, Fabrication Methods, Applications and Challenges
Auteur:
Soon, Chin Fhong Yee, See Khee Nordin, Anis Nurashikin Rahim, Rosminazuin Ab Ma, Nyuk Ling Hamed, Intan Sue Liana Abd Tee, Kian Sek Azmi, Nur Hanisah Sunar, Norshuhaila Mohamed Heng, Chris
Verschenen in:
International journal of precision engineering and manufacturing