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                                       Details for article 13 of 17 found articles
 
 
  Multilayer Fabrication of Micromolding and Electroforming with the Planarization of Grinding for High-Aspect-Ratio Microelectrodes in Electro-conjugate Fluid (ECF) Micropumps
 
 
Title: Multilayer Fabrication of Micromolding and Electroforming with the Planarization of Grinding for High-Aspect-Ratio Microelectrodes in Electro-conjugate Fluid (ECF) Micropumps
Author: Han, Dong
Yamada, Yoshiho
Yokota, Shinichi
Kim, Joon-wan
Appeared in: International journal of precision engineering and manufacturing
Paging: Volume 21 () nr. 5 pages 927-936
Year: 2020-01-19
Contents:
Publisher: Korean Society for Precision Engineering, Seoul
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

                             Details for article 13 of 17 found articles
 
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