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Journal description
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Details for article 4 of 16 found articles
| Title: |
An analytical model of chip heat-carrying capacity for high-speed dry hobbing based on 3D chip geometry |
| Author: |
Yang, Xiao Cao, Hua-jun Chen, Yong-peng Zhu, Li-Bin Li, Ben-jie |
| Appeared in: |
International journal of precision engineering and manufacturing |
| Paging: | Volume 18 (2017) nr. 2 pages 245-256 |
| Year: |
2017 |
| Contents: | |
| Publisher: |
Korean Society for Precision Engineering, Seoul |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 4 of 16 found articles
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