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Journal description
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Details for article 23 of 27 found articles
| Title: |
Polymer-based zero-level packaging technology for high frequency RF applications by wafer bonding/debonding technique using an anti-adhesion layer |
| Author: |
Kim, Jang-Gil Seok, Seonho Rolland, Nathalie Rolland, Paul-Alain |
| Appeared in: |
International journal of precision engineering and manufacturing |
| Paging: | Volume 13 (2012) nr. 10 pages 1861-1867 |
| Year: |
2012 |
| Contents: | |
| Publisher: |
Korean Society for Precision Engineering, Springer |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 23 of 27 found articles
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