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Journal description
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Details for article 19 of 20 found articles
| Title: |
Temperature distribution in polishing pad during CMP process: Effect of retaining ring |
| Author: |
Lee, Hyunseop Guo, Yongchang Jeong, Haedo |
| Appeared in: |
International journal of precision engineering and manufacturing |
| Paging: | Volume 13 (2012) nr. 1 pages 25-31 |
| Year: |
2012 |
| Contents: | |
| Publisher: |
Korean Society for Precision Engineering, Springer |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 19 of 20 found articles
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