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                                       Details for article 3 of 20 found articles
 
 
  Behavior and Mechanism of Void Welding Under Thermal Mechanical Coupling
 
 
Title: Behavior and Mechanism of Void Welding Under Thermal Mechanical Coupling
Author: Chen, Fei
Wang, Xitao
Chen, Huiqin
Dang, Shue
Appeared in: Metals and materials international
Paging: Volume 28 () nr. 7 pages 1751-1762
Year: 2021-09-26
Contents:
Publisher: The Korean Institute of Metals and Materials, Seoul
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

                             Details for article 3 of 20 found articles
 
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