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Details for article 8 of 50 found articles
| Title: |
Controlling Ag3Sn Plate Formation and Its Effect on the Creep Resistance of Sn–3.0Ag–0.7Cu Lead-Free Solder by Adding Minor Alloying Elements Fe, Co, Te and Bi |
| Author: |
El-Taher, A. M. Razzk, A. F. |
| Appeared in: |
Metals and materials international |
| Paging: | Volume 27 () nr. 10 pages 4294-4305 |
| Year: |
2020-08-31 |
| Contents: | |
| Publisher: |
The Korean Institute of Metals and Materials, Seoul |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 8 of 50 found articles
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