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                                       Details for article 4 of 28 found articles
 
 
  Correction to: Study on Aging Effect of Adhesion Strength Between Polyimide Film and Copper Layer
 
 
Title: Correction to: Study on Aging Effect of Adhesion Strength Between Polyimide Film and Copper Layer
Author: Koo, Seok-Bon
Lee, Chang-Myeon
Kwon, Sang-Jun
Jeon, Jun-Mi
Hur, Jin-young
Lee, Hong-Kee
Appeared in: Metals and materials international
Paging: Volume 25 (2019) nr. 3 pages 821
Year: 2019
Contents:
Publisher: The Korean Institute of Metals and Materials, Seoul
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

                             Details for article 4 of 28 found articles
 
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