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                                       Details for article 7 of 26 found articles
 
 
  Effect of a high-temperature pre-bake treatment on whisker formation under various thermal and humidity conditions for electrodeposited tin films on copper substrates
 
 
Title: Effect of a high-temperature pre-bake treatment on whisker formation under various thermal and humidity conditions for electrodeposited tin films on copper substrates
Author: Na, Seong-Hun
Lee, Mi-Ri
Park, Hwa-Sun
Kim, Heung-Kyu
Suh, Su-Jeong
Appeared in: Metals and materials international
Paging: Volume 20 (2014) nr. 2 pages 367-373
Year: 2014
Contents:
Publisher: The Korean Institute of Metals and Materials, Springer
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

                             Details for article 7 of 26 found articles
 
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