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Journal description
All volumes of the corresponding journal
All issues of the corresponding volume
All articles of the corresponding issues
Details for article 35 of 35 found articles
| Title: |
Stencil printing behavior of lead-free Sn-3Ag-0.5Cu solder paste for wafer level bumping for Sub-100 μm size solder bumps |
| Author: |
Kumar, Santosh Mallik, Sabuj Ekere, Ndy Jung, Jaepil |
| Appeared in: |
Metals and materials international |
| Paging: | Volume 19 (2013) nr. 5 pages 1083-1090 |
| Year: |
2013 |
| Contents: | |
| Publisher: |
Springer Netherlands, Dordrecht |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 35 of 35 found articles
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