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Journal description
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Details for article 11 of 26 found articles
| Title: |
Fabrication of electroplate Sn-Ag bumps without a lithography process for 3D packaging |
| Author: |
Jun, Jiheon Park, Jun Kyu Jung, Jae Pil |
| Appeared in: |
Metals and materials international |
| Paging: | Volume 18 (2012) nr. 3 pages 487-491 |
| Year: |
2012 |
| Contents: | |
| Publisher: |
The Korean Institute of Metals and Materials, Springer |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 11 of 26 found articles
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