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Journal description
All volumes of the corresponding journal
All issues of the corresponding volume
All articles of the corresponding issues
Details for article 20 of 54 found articles
| Title: |
Fabrication of Sn-Cu alloy solder by pulse electroplating on the metalized Si wafer |
| Author: |
Tang, Wengming Hu, Yang Huang, Shubin |
| Appeared in: |
Metals and materials international |
| Paging: | Volume 18 () nr. 1 pages 177-183 |
| Year: |
2012-02-27 |
| Contents: | |
| Publisher: |
Springer Netherlands, Dordrecht |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 20 of 54 found articles
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