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Journal description
All volumes of the corresponding journal
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All articles of the corresponding issues
Details for article 27 of 27 found articles
| Title: |
Use of novel chemical dipping method for the stability evaluation of an ultrathin TaNx barrier in Cu interconnects |
| Author: |
Pyo, Sung Gyu |
| Appeared in: |
Metals and materials international |
| Paging: | Volume 16 (2010) nr. 2 pages 293-297 |
| Year: |
2010 |
| Contents: | |
| Publisher: |
The Korean Institute of Metals and Materials, Springer |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 27 of 27 found articles
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