|
| << previous | next >> |
Journal description
All volumes of the corresponding journal
All issues of the corresponding volume
All articles of the corresponding issues
Details for article 17 of 25 found articles
| Title: |
Microstructure evolution in Cu pillar/eutectic SnPb solder system during isothermal annealing |
| Author: |
Kim, Byoung-Joon Lim, Gi-Tae Kim, Jaedong Lee, Kiwook Park, Young-Bae Lee, Ho-Young Joo, Young-Chang |
| Appeared in: |
Metals and materials international |
| Paging: | Volume 15 (2009) nr. 5 pages 815-818 |
| Year: |
2009 |
| Contents: | |
| Publisher: |
The Korean Institute of Metals and Materials, Springer |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 17 of 25 found articles
| << previous | next >> |