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Journal description
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Details for article 23 of 25 found articles
| Title: |
Study on the behavior characteristics of solder balls for FCBGA package |
| Author: |
Cho, Seunghyun Choi, Jinwon Kim, Hangoo |
| Appeared in: |
Metals and materials international |
| Paging: | Volume 15 (2009) nr. 2 pages 299-305 |
| Year: |
2009 |
| Contents: | |
| Publisher: |
The Korean Institute of Metals and Materials, Springer |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 23 of 25 found articles
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