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Microstructure evolution and resistivity of Cu(B) alloy films on Ti underlayer at the early stage of annealing at 500°C |
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Title: |
Microstructure evolution and resistivity of Cu(B) alloy films on Ti underlayer at the early stage of annealing at 500°C |
Author: |
Hong, T. K. Lee, S. Han, D. M. Lee, J. G. Lee, J. H. Kim, D. H. Jeong, C. O. Ruh, H. Lee, E. G. Kang, C. H. |
Appeared in: |
Metals and materials international |
Paging: |
Volume 14 (2008) nr. 5 pages 631-635 |
Year: |
2008 |
Contents: |
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Publisher: |
The Korean Institute of Metals and Materials, Seoul |
Source file: |
Elektronische Wetenschappelijke Tijdschriften |
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