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Microstructure evolution and resistivity of Cu(B) alloy films on Ti underlayer at the early stage of annealing at 500°C |
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Titel: |
Microstructure evolution and resistivity of Cu(B) alloy films on Ti underlayer at the early stage of annealing at 500°C |
Auteur: |
Hong, T. K. Lee, S. Han, D. M. Lee, J. G. Lee, J. H. Kim, D. H. Jeong, C. O. Ruh, H. Lee, E. G. Kang, C. H. |
Verschenen in: |
Metals and materials international |
Paginering: |
Jaargang 14 (2008) nr. 5 pagina's 631-635 |
Jaar: |
2008 |
Inhoud: |
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Uitgever: |
The Korean Institute of Metals and Materials, Seoul |
Bronbestand: |
Elektronische Wetenschappelijke Tijdschriften |
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