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                                       Details for article 10 of 20 found articles
 
 
  Microstructure evolution and resistivity of Cu(B) alloy films on Ti underlayer at the early stage of annealing at 500°C
 
 
Title: Microstructure evolution and resistivity of Cu(B) alloy films on Ti underlayer at the early stage of annealing at 500°C
Author: Hong, T. K.
Lee, S.
Han, D. M.
Lee, J. G.
Lee, J. H.
Kim, D. H.
Jeong, C. O.
Ruh, H.
Lee, E. G.
Kang, C. H.
Appeared in: Metals and materials international
Paging: Volume 14 (2008) nr. 5 pages 631-635
Year: 2008
Contents:
Publisher: The Korean Institute of Metals and Materials, Seoul
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

                             Details for article 10 of 20 found articles
 
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