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Details for article 18 of 21 found articles
| Title: |
Tensile behavior of commercially pure copper sheet fabricated by 2-and 3-layered accumulative roll bonding (ARB) process |
| Author: |
Jang, Younghwan Kim, Sangshik Han, Seungzeon Lim, Chayong Goto, Masahiro |
| Appeared in: |
Metals and materials international |
| Paging: | Volume 14 (2008) nr. 2 pages 171-175 |
| Year: |
2008 |
| Contents: | |
| Publisher: |
The Korean Institute of Metals and Materials, Seoul |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 18 of 21 found articles
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