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Journal description
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Details for article 26 of 26 found articles
| Title: |
Thermomechanical stability of memory package with LOC structure |
| Author: |
Lee, Seong-Min |
| Appeared in: |
Metals and materials international |
| Paging: | Volume 11 () nr. 1 pages 89-93 |
| Year: |
2009-02-16 |
| Contents: | |
| Publisher: |
The Korean Institute of Metals and Materials, Seoul |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 26 of 26 found articles
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