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Reduced thermal boundary conductance in GaN-based electronic devices introduced by metal bonding layer |
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Titel: |
Reduced thermal boundary conductance in GaN-based electronic devices introduced by metal bonding layer |
Auteur: |
Yang, Susu Song, Houfu Peng, Yan Zhao, Lu Tong, Yuzhen Kang, Feiyu Xu, Mingsheng Sun, Bo Wang, Xinqiang |
Verschenen in: |
Nano research |
Paginering: |
Jaargang 14 () nr. 10 pagina's 3616-3620 |
Jaar: |
2021-07-08 |
Inhoud: |
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Uitgever: |
Tsinghua University Press, Beijing |
Bronbestand: |
Elektronische Wetenschappelijke Tijdschriften |
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