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                                       Details for article 7 of 50 found articles
 
 
  Analysis of thermal and wet stress of corn kernel based on microwave drying
 
 
Title: Analysis of thermal and wet stress of corn kernel based on microwave drying
Author: Sun, Tongsheng
Cao, Ran
Appeared in: Journal of mechanical science and technology
Paging: Volume 37 () nr. 3 pages 1501-1508
Year: 2023-02-28
Contents:
Publisher: Korean Society of Mechanical Engineers, Seoul
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

                             Details for article 7 of 50 found articles
 
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