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Journal description
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Details for article 36 of 48 found articles
| Title: |
Numerical study on thermal stress cutting of silicon wafers using two-line laser beams |
| Author: |
Choi, Sungho Jhang, Kyung-Young |
| Appeared in: |
Journal of mechanical science and technology |
| Paging: | Volume 33 (2019) nr. 8 pages 3621-3627 |
| Year: |
2019 |
| Contents: | |
| Publisher: |
Korean Society of Mechanical Engineers, Seoul |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 36 of 48 found articles
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