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Journal description
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Details for article 22 of 57 found articles
| Title: |
Effect of conditioner load on the polishing pad surface during chemical mechanical planarization process |
| Author: |
Shin, Cheolmin Qin, Hongyi Hong, Seokjun Jeon, Sanghyuk Kulkarni, Atul Kim, Taesung |
| Appeared in: |
Journal of mechanical science and technology |
| Paging: | Volume 30 (2016) nr. 12 pages 5659-5665 |
| Year: |
2016 |
| Contents: | |
| Publisher: |
Korean Society of Mechanical Engineers, Seoul |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 22 of 57 found articles
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