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                                       Details for article 10 of 11 found articles
 
 
  Investigation of wall-slip effect on lead-free solder paste and isotropic conductive adhesives
 
 
Title: Investigation of wall-slip effect on lead-free solder paste and isotropic conductive adhesives
Author: Durairaj, R.
Mallik, S.
Seman, A.
Ekere, N. N.
Appeared in: S¯adhan¯a
Paging: Volume 34 (2009) nr. 5 pages 799-810
Year: 2009
Contents:
Publisher: Springer-Verlag, India
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

                             Details for article 10 of 11 found articles
 
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 Koninklijke Bibliotheek - National Library of the Netherlands