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                                       Details for article 5 of 14 found articles
 
 
  Induction heating of solder ball leads for assembly of BGA packages
 
 
Title: Induction heating of solder ball leads for assembly of BGA packages
Author: Lanin, V. L.
Sergachev, I. I.
Khot’kin, V. T.
Appeared in: Surface engineering and applied electrochemistry
Paging: Volume 51 (2015) nr. 2 pages 162-166
Year: 2015
Contents:
Publisher: Allerton Press, New York
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

                             Details for article 5 of 14 found articles
 
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