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                                       Details for article 15 of 27 found articles
 
 
  Investigating and optimizing electrophysical processes for joining tensomodule elements based on a silicon-on-insulator heterostructure by thermoelectrically stimulated bonding
 
 
Title: Investigating and optimizing electrophysical processes for joining tensomodule elements based on a silicon-on-insulator heterostructure by thermoelectrically stimulated bonding
Author: Timoshenkov, S. P.
Kalugin, V. V.
Sokolov, L. V.
Parfenov, N. M.
Appeared in: Bulletin of the Russian Academy of Sciences. Physics
Paging: Volume 75 (2011) nr. 9 pages 1251-1253
Year: 2011
Contents:
Publisher: Allerton Press, Inc., Heidelberg
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

                             Details for article 15 of 27 found articles
 
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