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                                       Details for article 4 of 17 found articles
 
 
  Effect of Aging Temperature on the Microstructure and Shear Strength of SAC0307-0.1Ni Lead-Free Solders in Copper Joints
 
 
Title: Effect of Aging Temperature on the Microstructure and Shear Strength of SAC0307-0.1Ni Lead-Free Solders in Copper Joints
Author: Phairote Sungkhaphaitoon,
Suchart Chantaramanee,
Appeared in: Russian journal of non-ferrous metals
Paging: Volume 61 () nr. 1 pages 89-98
Year: 2020-03-29
Contents:
Publisher: Pleiades Publishing, Moscow
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

                             Details for article 4 of 17 found articles
 
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