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                                       Details for article 36 of 40 found articles
 
 
  Three Dimensional Characterization of Tin Crystallography and Cu6Sn5 Intermetallics in Solder Joints by Multiscale Tomography
 
 
Title: Three Dimensional Characterization of Tin Crystallography and Cu6Sn5 Intermetallics in Solder Joints by Multiscale Tomography
Author: Kirubanandham, A.
Lujan-Regalado, I.
Vallabhaneni, R.
Chawla, N.
Appeared in: JOM
Paging: Volume 68 (2016) nr. 11 pages 2879-2887
Year: 2016
Contents:
Publisher: Springer US, New York
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

                             Details for article 36 of 40 found articles
 
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 Koninklijke Bibliotheek - National Library of the Netherlands