A Comparative Study on the Microstructure and Mechanical Properties of Cu6Sn5 and Cu3Sn Joints Formed by TLP Soldering With/Without the Assistance of Ultrasonic Waves
Titel:
A Comparative Study on the Microstructure and Mechanical Properties of Cu6Sn5 and Cu3Sn Joints Formed by TLP Soldering With/Without the Assistance of Ultrasonic Waves
Auteur:
Zhao, H. Y. Liu, J. H. Li, Z. L. Song, X. G. Zhao, Y. X. Niu, H. W. Tian, H. Dong, H. J. Feng, J. C.
Verschenen in:
Metallurgical and materials transactions. A, Physical metallurgy and materials science