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Journal description
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Details for article 14 of 55 found articles
| Title: |
Effect of Sn Grain Orientation on the Cu6Sn5 Formation in a Sn-Based Solder Under Current Stressing |
| Author: |
Lin, Chih-Fan Lee, Shang-Hua Chen, Chih-Ming |
| Appeared in: |
Metallurgical and materials transactions. A, Physical metallurgy and materials science |
| Paging: | Volume 43 (2012) nr. 8 pages 2571-2573 |
| Year: |
2012 |
| Contents: | |
| Publisher: |
Springer US, Boston |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 14 of 55 found articles
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