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Journal description
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Details for article 6 of 23 found articles
| Title: |
Dissolution and Interface Reactions between Palladium and Tin (Sn)-Based Solders: Part I. 95.5Sn-3.9Ag-0.6Cu Alloy |
| Author: |
Vianco, Paul T. Rejent, Jerome A. Zender, Gary L. Hlava, Paul F. |
| Appeared in: |
Metallurgical and materials transactions. A, Physical metallurgy and materials science |
| Paging: | Volume 41 (2010) nr. 12 pages 3042-3052 |
| Year: |
2010 |
| Contents: | |
| Publisher: |
Springer US, Boston |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 6 of 23 found articles
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