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Details for article 16 of 20 found articles
| Title: |
Predicted thermal stresses in a bow-free adhesively bonded assembly for photonic packaging applications - Prognose thermisch induzierter Spannungen in einem verwölbungsfrei geklebten Schichtaufbau für Anwendungen im optoelektronischen Packaging |
| Author: |
Suhir, E. |
| Appeared in: |
E & I |
| Paging: | Volume 120 (2003) nr. 6 pages 195-199 |
| Year: |
2003 |
| Contents: | |
| Publisher: |
Springer Vienna, Vienna |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 16 of 20 found articles
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