|
| << previous | next >> |
Journal description
All volumes of the corresponding journal
All issues of the corresponding volume
All articles of the corresponding issues
Details for article 3 of 28 found articles
| Title: |
A microslip model of the bonding process in ultrasonic wire bonders Part I: Transient response |
| Author: |
Hu, C.M. Guo, N. Du, H. Li, W.H. Chen, M. |
| Appeared in: |
The international journal of advanced manufacturing technology |
| Paging: | Volume 29 (2006) nr. 9-10 pages 860-866 |
| Year: |
2006 |
| Contents: | |
| Publisher: |
Springer-Verlag, Berlin/Heidelberg |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 3 of 28 found articles
| << previous | next >> |