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  Fatigue of SMT solder joint including torsional curvature and chip location optimization
 
 
Title: Fatigue of SMT solder joint including torsional curvature and chip location optimization
Author: Guo, Qiang
Zhao, Mei
Appeared in: The international journal of advanced manufacturing technology
Paging: Volume 26 (2004) nr. 7-8 pages 887-895
Year: 2004
Contents:
Publisher: Springer Berlin Heidelberg, Berlin/Heidelberg
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

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