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  A module-based thermal design approach for distributed product development
 
 
Title: A module-based thermal design approach for distributed product development
Author: Seki, Kenichi
Nishimura, Hidekazu
Appeared in: Research in engineering design
Paging: Volume 22 (2011) nr. 4 pages 279-295
Year: 2011
Contents:
Publisher: Springer-Verlag, London
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

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 Koninklijke Bibliotheek - National Library of the Netherlands