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Journal description
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Details for article 2 of 16 found articles
| Title: |
Analysis of selective bonding processes using reactive multi-layers for system integration on LTCC based SiPs |
| Author: |
Yuile, A. Schulz, A. Müller, J. Wiese, S. |
| Appeared in: |
Microsystem technologies |
| Paging: | Volume 28 () nr. 9 pages 1995-2009 |
| Year: |
2022-08-01 |
| Contents: | |
| Publisher: |
Springer Berlin Heidelberg, Berlin/Heidelberg |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 2 of 16 found articles
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