|
| << previous | next >> |
Journal description
All volumes of the corresponding journal
All issues of the corresponding volume
All articles of the corresponding issues
Details for article 19 of 35 found articles
| Title: |
Hot embossing of microfluidics in cyclic-olefin co-polymer using a wafer aligner-bonder |
| Author: |
Asif, Muhammad Tait, R. Niall Berini, Pierre |
| Appeared in: |
Microsystem technologies |
| Paging: | Volume 27 () nr. 10 pages 3899-3906 |
| Year: |
2021-01-05 |
| Contents: | |
| Publisher: |
Springer Berlin Heidelberg, Berlin/Heidelberg |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 19 of 35 found articles
| << previous | next >> |