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Journal description
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Details for article 30 of 36 found articles
| Title: |
Screwed micro fluidic connections fabricated by ultrasonic hot embossing and welding |
| Author: |
Lee, H.-J. Sackmann, J. Park, K. Schomburg, W. K. |
| Appeared in: |
Microsystem technologies |
| Paging: | Volume 25 (2018) nr. 10 pages 3825-3834 |
| Year: |
2018 |
| Contents: | |
| Publisher: |
Springer Berlin Heidelberg, Berlin/Heidelberg |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 30 of 36 found articles
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