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                                       Details for article 13 of 26 found articles
 
 
  Low-cost silicon wafer dicing using a craft cutter
 
 
Title: Low-cost silicon wafer dicing using a craft cutter
Author: Fan, Yiqiang
Arevalo, Arpys
Li, Huawei
Foulds, Ian G.
Appeared in: Microsystem technologies
Paging: Volume 21 (2014) nr. 7 pages 1411-1414
Year: 2014
Contents:
Publisher: Springer Berlin Heidelberg, Berlin/Heidelberg
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

                             Details for article 13 of 26 found articles
 
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