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Journal description
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Details for article 22 of 25 found articles
| Title: |
The effect of temporary bonding on post processing in TSV interposer manufacturing |
| Author: |
Wang, Qibing Yu, Daquan Jiang, Feng Liu, Haiyan Jing, Xiangmeng |
| Appeared in: |
Microsystem technologies |
| Paging: | Volume 21 (2014) nr. 4 pages 749-755 |
| Year: |
2014 |
| Contents: | |
| Publisher: |
Springer Berlin Heidelberg, Berlin/Heidelberg |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 22 of 25 found articles
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