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Journal description
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Details for article 51 of 52 found articles
| Title: |
Wafer bonding using Cu–Sn intermetallic bonding layers |
| Author: |
Flötgen, C. Pawlak, M. Pabo, E. Wiel, H. J. van de Hayes, G. R. Dragoi, V. |
| Appeared in: |
Microsystem technologies |
| Paging: | Volume 20 (2013) nr. 4-5 pages 653-662 |
| Year: |
2013 |
| Contents: | |
| Publisher: |
Springer Berlin Heidelberg, Berlin/Heidelberg |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 51 of 52 found articles
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