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                                       Details for article 12 of 16 found articles
 
 
  Novel interconnection technology for heterogeneous integration of MEMS–LSI multi-chip module
 
 
Title: Novel interconnection technology for heterogeneous integration of MEMS–LSI multi-chip module
Author: Lee, Kang-Wook
Koyanagi, Mitsumasa
Appeared in: Microsystem technologies
Paging: Volume 16 (2009) nr. 3 pages 441-447
Year: 2009
Contents:
Publisher: Springer-Verlag, Berlin/Heidelberg
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

                             Details for article 12 of 16 found articles
 
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