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                                       Details for article 23 of 30 found articles
 
 
  Particleboard I.B. forcast by TMA bending in UF adhesives curing
 
 
Title: Particleboard I.B. forcast by TMA bending in UF adhesives curing
Author: Laigle, Y.
Kamoun, C.
Pizzi, A.
Appeared in: Holz als Roh- und Werkstoff
Paging: Volume 56 (1998) nr. 3 pages 154
Year: 1998
Contents:
Publisher: Springer-Verlag, Berlin/Heidelberg
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

                             Details for article 23 of 30 found articles
 
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 Koninklijke Bibliotheek - National Library of the Netherlands