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                                       Details for article 13 of 19 found articles
 
 
  Investigation on the structure function of an electronic packaging to verify detailed thermal model assumptions
 
 
Title: Investigation on the structure function of an electronic packaging to verify detailed thermal model assumptions
Author: Dupuis, Quentin
Bissuel, Valentin
Laraqi, Najib
Bauzin, Jean-Gabriel
Nguyen, Minh-Nhat
Appeared in: Heat and mass transfer
Paging: Volume 60 () nr. 12 pages 1-14
Year: 2023-01-03
Contents:
Publisher: Springer Berlin Heidelberg, Berlin/Heidelberg
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

                             Details for article 13 of 19 found articles
 
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