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Details for article 10 of 11 found articles
| Title: |
Residual Thermal Strain Distribution Measurement of Underfills in Flip Chip Electronic Packages by an Inverse Approach Based on the Sampling Moiré Method |
| Author: |
Wang, Q. Ri, S. Enomoto, T. |
| Appeared in: |
Experimental mechanics |
| Paging: | Volume 60 () nr. 5 pages 611-626 |
| Year: |
2020-01-15 |
| Contents: | |
| Publisher: |
Springer US, New York |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 10 of 11 found articles
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