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Journal description
All volumes of the corresponding journal
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All articles of the corresponding issues
Details for article 13 of 17 found articles
| Title: |
Microscopic analysis of the engineering geological behavior of soft clay in Shanghai, China |
| Author: |
Yang, Tian-Liang Gong, Shi-Liang |
| Appeared in: |
Bulletin of engineering geology and the environment |
| Paging: | Volume 69 (2010) nr. 4 pages 607-615 |
| Year: |
2010 |
| Contents: | |
| Publisher: |
Springer-Verlag, Berlin/Heidelberg |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 13 of 17 found articles
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