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Journal description
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Details for article 9 of 35 found articles
| Title: |
Effects of composition and cooling rate on the microstructure of Sn–3.7Ag–0.9Zn–Bi solders |
| Author: |
Wang, X. Liu, Y. C. Wei, C. Yu, L. M. Gao, Z. M. Dong, Z. Z. |
| Appeared in: |
Applied physics. Part A, Materials science and processing |
| Paging: | Volume 96 (2009) nr. 4 pages 969-973 |
| Year: |
2009 |
| Contents: | |
| Publisher: |
Springer-Verlag, Berlin/Heidelberg |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 9 of 35 found articles
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