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  Approaches to diffusion barrier creation and trench filling for copper interconnection formation
 
 
Title: Approaches to diffusion barrier creation and trench filling for copper interconnection formation
Author: Gromov, D.G.
Mochalov, A.I.
Klimovitskiy, A.G.
Sulimin, A.D.
Redichev, E.N.
Appeared in: Applied physics. Part A, Materials science and processing
Paging: Volume 81 (2005) nr. 7 pages 1337-1343
Year: 2005
Contents:
Publisher: Springer Berlin Heidelberg, Berlin/Heidelberg
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

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