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Journal description
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Details for article 85 of 101 found articles
| Title: |
Study on the effect of diamond wire saw-cutting process parameters on brittle cracks in monocrystalline silicon |
| Author: |
Sun, Penglei Wei, Chen Zhang, Hui Zhang, Haiming Gao, Kun Wu, Jianhai Li, Kai Chen, Guifeng |
| Appeared in: |
Applied physics. Part A, Materials science and processing |
| Paging: | Volume 130 () nr. 10 pages xx |
| Year: |
2024-09-25 |
| Contents: | |
| Publisher: |
Springer Berlin Heidelberg, Berlin/Heidelberg |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 85 of 101 found articles
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