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Details for article 12 of 75 found articles
| Title: |
Atomistic simulation of mechanical behavior of Cu/Cu3Sn solder interface with Kirkendall void under shear and tensile deformation |
| Author: |
Wu, Cheng-Da Liu, Kai-Wei Cheng, Po-Chien |
| Appeared in: |
Applied physics. Part A, Materials science and processing |
| Paging: | Volume 129 () nr. 4 pages xx |
| Year: |
2023-03-13 |
| Contents: | |
| Publisher: |
Springer Berlin Heidelberg, Berlin/Heidelberg |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 12 of 75 found articles
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